G06400 - SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) StdPbc-0415 4 The DCV sections of

4  The DCV sections of this Test Method refer to closed vessel microwave acid decomposition at elevated temperature and pressure

Each technology has unique strengths and weaknesses—some rely on front-surface illumination

2  This Guide may be used by semiconductor factory engineers and suppliers for developing site-specific basis of design and performance criteria

" Where an analytical procedure different from that provided is substituted by a supplier or user

This Test Method can be used for various materials depending on the purposes

G06400 - SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) StdPbc-0415 4 The DCV sections ofThis Specification is intended as a guideline for evaluating plating layer characteristics required by users of full plated leadframes for plastic semiconductor packages. Background Full plated leadframes have received attention in recent years as a possible solution to challenges and restrictions resulting from the effects of Pb on the environment, package reliability improvement due to the P. P. F. process, lead coplanarity on fine pitched