Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Ingestion-build-224916 ISBN 0 580 25766 5

ISBN 0 580 25766 5

and requirements for the assemblies themselves

This method is also applicable to stress-rupture evaluations of pipes which are difficult to test

and of reconnecting the safety lights to the normal source when this source is restored

you can standardize the operating conditions of mechanical influences to land-based and off-shore

Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Ingestion-build-224916 ISBN 0 580 25766 51 Scope This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine pitch Ball Grid Array (FBGA), and Fine pitch Land Grid Array (FLGA).