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SEMI MF1152-0305 (Reapproved 0211)
Safety Supervisors’ Communication Council (SSCC)
This Test Method provides the procedure to determine whether a specific particle deposition system
26-0301 (Withdrawn 0312
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G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages Revision:SEMI G9-89 - Inactive SEMI MF1152-0305 (Reapproved 0211)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for the stamping manufacture of leadframes for plastic molded dual in line semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers and mold
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