G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Revision:Default Title SEMI M80-0116 (technical revision)

Name: G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Revision:Default Title SEMI M80-0116 (technical revision)
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Description

SEMI M80-0116 (technical revision)

Such wafers are usually sliced from cylindrical single-crystal ingots that have been ground to a uniform diameter prior to slicing

SEMI G9-84 (technical revision)

This specification defines the physical requirements for preforms made with thermosetting molding compounds

This Document defines the representation of Error

G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Revision:Default Title SEMI M80-0116 (technical revision)This specification defines the acceptance criteria for ceramic pin grid array packages produced utilizing pressed ceramic, mechanically inserted pins and solder for electrical interconnection of pins. Referenced SEMI Standards None.

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