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M03500 - SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド Revision:SEMI M35-1107 - Superseded SEMI C31-0301 (technical revision)

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Description

SEMI C31-0301 (technical revision)

SEMI D65-0719 (technical revision)

This desired characteristic is generally known as electromagnetic compatibility (EMC)

It also causes not only wafers

The format and algorithm for the Data Matrix code is based on two-dimensional symbology specified in ISO/IEC 16022

M03500 - SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド Revision:SEMI M35-1107 - Superseded SEMI C31-0301 (technical revision)global Silicon Wafer Committee200795global Audits and Reviews Subcommittee200710www. semi. org200711CD ROM19992200511 SSISscanning surface inspection systems Referenced SEMI Standards SEMI M1 Specifications for Polished Monocrystalline Polished Silicon Wafers SEMI M53 Practice for Calibrating Scanning Surface Inspection Systems using Depositions of Monodisperse Polystyrene Latex Sphere on Unpatterned Semiconductor Wafer Surfaces

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